BPA(10)EODMA CAS 41637-38-1

CAS:41637-38-1

Molecular Formula:(C2H4O)n(C2H4O)nC23H24O4

Molecular Weight:452

EINECS:609-946-4

Nguva yekuchengeta:1 gore

Shoko rakafanana:DPD1; TGFB; Diaphyseal dysplasia 1; Progressive; Diethyl carbote

Siya Mharidzo Yako

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Chii chinonzi BPA(10)EODMA CAS 41637-38-1?

Diethyl carbonate imhando yemvura isina ruvara uye yakajeka uye inonhuwa zvishoma. Isinganyunguriki mumvura, inonyungudika muorganic solvents senge doro uye ether.

Tsanangudzo

ITEM	STANDARD
Chitarisiko	Zvakajeka uye zvakajeka
Viscosity	350 ~ 450 cP
Asidhi kukosha	≤0.50 mg KOH/g
Color	≤100 APHA
Specific giravhiti	1.110 ~ 1.130

Application

(1) UV-yakarapwa zvinhu (UV kurapa
Coatings neingi
Sezvinoita diluent, inoshandiswa muUV-inorapika machira (akadai sehuni machira uye simbi coatings) kuwedzera kuoma uye makemikari kuramba.
Deredza shrinkage kushushikana mukudhinda inki kudzivirira substrate deformation.

3D kudhinda resin
High reactivity uye yakaderera viscosity inoita kuti ive yakakodzera kune chiedza-kurapa 3D kudhinda (senge mazino emhando uye zvikamu zvakanyatsorongeka).

(2) Zvinhu zvemazino
Composite resin
Kana yakabatanidzwa negirazi mafirita (akadai seSiO₂), inoshandiswa mukugadzirisa mazino zvinhu (kuzadza, veneers), ine zvese simba uye aesthetics.

Adhesive:
Sechikamu chemazino anonamira, inorapa nekukurumidza uye ine yakanaka biocompatibility.

(3) Electronic kurongedza
Insulating zvinhu
Encapsulation adhesive yePCB (yakadhindwa Circuit board), inodzivirira kupisa uye hunyoro-uchapupu.

Photoresist
Sechikamu che photosensitive resin, inoshandiswa mune graphical maitiro ekugadzira semiconductor.

(4) Adhesive
Structural adhesive
Kana yakasanganiswa ne epoxy resin, inosimudzira kuoma uye kunamatira (senge mumotokari uye aerospace bonding).