Tsanangudzo yepamusoro Bisphenol a Ethoxylate Dimethacrylate CAS 41637-38-1 ine Factory Price
Isu tinogara tichiita mweya wedu we "Innovation inounza kusimudzira, Yepamusoro-mhando yekuita chokwadi chekurarama, Management inosimudzira purofiti, Chikwereti chibodzwa chinokwezva tarisiro yeYakakwirira tsananguro Bisphenol a Ethoxylate Dimethacrylate CAS 41637-38-1 neFactory Mutengo, Senyanzvi inyanzvi mundima iyi, isu takazvipira kugadzirisa dambudziko rakakura.
Isu tinogara tichiita mweya wedu we "Innovation inounza kusimudzira, Yepamusoro-mhando yekuita chokwadi chekurarama, Management inosimudzira purofiti, Chikwereti chibodzwa chinokwezva tarisiro ye, Kuti tisangane nezviri kuwedzera zvinodiwa nevatengi kumba nevari mukati, ticharamba tichiendesa mberi mweya webhizinesi we "Unhu, Kusika, Kubudirira uye Chikwereti" uye toyedza uye nekukutungamirirai kushandirapamwe kune fashoni.
Diethyl carbonate imhando yemvura isina ruvara uye yakajeka uye inonhuwa zvishoma. Isinganyunguriki mumvura, inonyungudika muorganic solvents senge doro uye ether.
| ITEM | STANDARD |
| Chitarisiko | Zvakajeka uye zvakajeka |
| Viscosity | 350 ~ 450 cP |
| Asidhi kukosha | ≤0.50 mg KOH/g |
| Color | ≤100 APHA |
| Specific giravhiti | 1.110 ~ 1.130 |
(1) UV-yakarapwa zvinhu (UV kurapa
Coatings neingi
Sezvinoita diluent, inoshandiswa muUV-inorapika machira (akadai sehuni machira uye simbi coatings) kuwedzera kuoma uye makemikari kuramba.
Deredza shrinkage kushushikana mukudhinda inki kudzivirira substrate deformation.
3D kudhinda resin
High reactivity uye yakaderera viscosity inoita kuti ive yakakodzera kune chiedza-kurapa 3D kudhinda (senge mazino emhando uye zvikamu zvakanyatsorongeka).
(2) Zvinhu zvemazino
Composite resin
Kana yakabatanidzwa negirazi mafirita (akadai seSiO₂), inoshandiswa mukugadzirisa mazino zvinhu (kuzadza, veneers), ine zvese simba uye aesthetics.
Adhesive:
Sechikamu chemazino anonamira, inorapa nekukurumidza uye ine yakanaka biocompatibility.
(3) Electronic kurongedza
Insulating zvinhu
Encapsulation adhesive yePCB (yakadhindwa Circuit board), inodzivirira kupisa uye hunyoro-uchapupu.
Photoresist
Sechikamu che photosensitive resin, inoshandiswa mune graphical maitiro ekugadzira semiconductor.
(4) Adhesive
Structural adhesive
Kana yakasanganiswa ne epoxy resin, inosimudzira kuoma uye kunamatira (senge mumotokari uye aerospace bonding).
200kg/zvigubhu
Isu tinogara tichiita mweya wedu we "Innovation inounza kusimudzira, Yepamusoro-mhando yekuita chokwadi chekurarama, Management inosimudzira purofiti, Chikwereti chibodzwa chinokwezva tarisiro yeYakakwirira tsananguro Bisphenol a Ethoxylate Dimethacrylate CAS 41637-38-1 neFactory Mutengo, Senyanzvi inyanzvi mundima iyi, isu takazvipira kugadzirisa dambudziko rakakura.
Tsanangudzo yepamusoro Bisphenol a Ethoxylate Dimethacrylate uye Bisphenol, Kuti tisangane nezviri kuwedzera zvinodiwa nevatengi kumba nevari mukati, ticharamba tichiendesa mberi mweya webhizinesi we "Hunhu, Kusika, Kubudirira uye Chikwereti" uye tichiedza kusimudzira maitiro aripo uye kutungamira fashoni. Tinokugamuchirai noushamwari kushanyira kambani yedu uye kuita kushandira pamwe.
